INMECOS

PiX 410C

Bendable digital X-ray detector for curved inspection geometries.

According to the manufacturer documentation, PiX 410C is a flexible a-Si TFT detector for industrial radiography. Its bendable design can reduce the distance to curved surfaces and improve inspection geometry.

PiX 410C
Key points

For demanding inspection tasks

  • 99 µm pixel pitch
  • Flexible design for pipes and curved components
  • 16-bit grayscale
  • IP67
  • 40-450 kVp; optimized for Gamma Ray use according to manufacturer

Consulting beyond product selection

We look at application, geometry, radiation source, required image quality and workflow together before recommending a system.

Technical specifications

PiX 410C

Technology Flexible a-Si TFT
Scintillator Gadox
Pixel matrix 981 x 2517
Pixel pitch 99 µm
Image size 3.82 x 9.80 in
Grayscale 16 bit
X-ray voltage range 40-450 kVp; optimized for Gamma Ray use
Maximum exposure time 180 s
Data interface Gigabit Ethernet
Image acquisition time Wired 1.5 s; Wireless 3 s
Weight 3 lb + optional protective armor
Ingress protection IP67

Technical data according to the supplied manufacturer documentation. Manufacturer specifications may change.

Discuss your project

Would you like to determine whether this system fits your application? We support selection, system configuration, integration and project implementation.

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